Milling printed circuit boards in the electronics Lab
- LPKF quality at an entry-level rate
- With powerful CAM software
- Single and double sided printed circuit boards
- Ideal for research and training
Small and strong
The main field of application for theProtomat E44 is milling structures in copper-coated circuit board material, drilling through holes or milling individual circuit boards from larger panels. This ProtoMat already shows their advantages with smaller quantities or in occasional use: It offers similar precision as the high-speed ProtoMat S-series systems, but is limited to the essentials. The LPKF ProtoMat E44 has a spindle with 40000 rpm. For manual tool change, the system features a collet chuck with precise height adjustment by micrometer screw.
The supplied LPKF CircuitPro CAM software facilitates the solution of production requirements. It offers extensive access to all process parameters. A comprehensive parameter library for many common materials supports the operator in his own projects.
Register system and camera
In addition to increased positioning accuracy on double-sided PCBs, the camera's measurement function helps the ProtoMat E44 to set the routing channels more easily. After the measuring process, the machine software guides the user to the optimal setting. Register systems are indispensable for processing double-sided PCBs: they hold the processed PCBs securely in one position, even after turning them over for structuring the second side. With the E44, a camera helps with positioning: It recognizes fiducials or geometric structures and aligns the structuring to them. With a resolution of less than 1 μm, a repeatability of ±5 μm and a precision in the fitting hole system of ±20 μm, the small circuit board plotter more than meets the requirements for single or double-sided circuit boards.
LPKF Circuit Board Plotter at a glance
Comparison LPKF Circuit Board Plotter
|Milling / Drilling of 1- & 2-sided circuit boards||•||•||•|
|Milling / Drilling RF-, Microwave-Substrates||-||•||•|
|Milling / drilling of multilayers up to 8 layers||•||•||•|
|Routing of printed circuit boards||•||•||•|
|Engraving of front panels / signs||-||-||•|
|Milling cut-outs in front panels||•||•||•|
|Milling of SMD solder paste stencils||-||•||•|
|Machining of housings||-||•||•|
|Milling of solder frames||-||•||•|
|Depaneling, reworking of printed circuit boards||-||•||•|
|Drilling of test adapters||-||•||•|