News & Press

LPKF press section –
news and image archive

Press Releases

Here we have listed our current announcements on technology and product innovations as well as IR press releases. Mandatory publications can be found in the Investor Relations section.

Order intake rises in the first quarter (book-to-bill ratio: 1.4) / Good progress in Advanced Semicon Packaging / North Star transformation program…
Specialized solution for welding two absorbing plastic components successfully introduced to the market / Integrated thermography enables process…
Glass-based advanced packaging gains momentum – LIDE technology is well positioned, vertical integration further expanded / Cautious outlook for 2026:…
LPKF develops glass components for ion traps, vacuum chambers and quantum sensors in three projects / Laser micromachining of glass provides the…
Business performance recovers in the third quarter / Business development and growth potential vary between segments / “North Star” strategic…

Digital Image Archive

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LPKF Logo 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LOGO_LPKF.png (png - 27,39 KB)
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High Volume Manufacturing of Micro Precision Glass Components

 

Bildautor: LPKF Laser & Electronics SE
Bildnutzung: Das Foto darf für Berichte unter Angabe der Quelle verwendet werden. Der Weiterverkauf an Dritte ist untersagt.

High Volume Manufacturing of Micro Precision Glass Components (jpg - 1,39 MB)
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Tensor Bonding for Glass Applications

LPKF Tensor Bonding

Tensor Bonding for Glass Applications.
 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Tensor_Bonding_for_Glass_Applications.jpg (jpg - 878,14 KB)
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Microstructures in glass including bonding and waveguides

LPKF Waveguides

Microstructures in glass including bonding and waveguides.


Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Microstructures_in_Glass_including_bonding_and_waveguides.jpg (jpg - 1,08 MB)
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VITRION LIDE Glass Wafer (horizontal)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

VITRION_LIDE_Glass_Wafer_horizontal.jpg (jpg - 1,19 MB)
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Image of LPKF main building in Garbsen (horizontal)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Corporate_LPKF_Building_horizontal.jpg (jpg - 3,00 MB)
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Image of LPKF main building in Garbsen (vertical)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Corporate_LPKF_Building_vertical.jpg (jpg - 2,73 MB)
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Foto vom Consulting bei LaserMicronics (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LaserMicronics_Consulting_horizontal.jpg (jpg - 1,26 MB)
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LPKF Laser PCB Prototyping (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_Laser_PCB_Prototyping_horizontal.jpg (jpg - 741,19 KB)
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LPKF Laser Depaneling Interior (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_LaserDepaneling_Innenraum_horizontal.jpg (jpg - 1,33 MB)
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LPKF Laser Plastic Welding Automotive (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_Laser_Plastic_Welding_Automotive_horizontal.jpg (jpg - 1,28 MB)
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LPKF Laser Depaneling (horizontal)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_Laser_Depaneling_horizontal.jpg (jpg - 1,32 MB)
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VITRION Foundry LIDE Clean Room (horizontal)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

VITRION_Foundry_LIDE_Clean_Room_horizontal.jpg (jpg - 1,44 MB)
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LPKF Electronics CleanCut (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_Electronics_CleanCut_horizontal.jpg (jpg - 1,69 MB)
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Image of LPKF CEO Klaus Fiedler (lateral)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Corporate_LPKF_Klaus_Fiedler_CEO_seitlich_horizontal.jpg (jpg - 1,01 MB)
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Image of LPKF CFO Peter Mümmler (front)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Peter_Muemmler_Portrait_front (jpg - 2,06 MB)
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LaserMicronics Manufacturing Service (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LaserMicronics_Manufacturing_Service_horizontal.jpg (jpg - 916,05 KB)
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LPKF Laser Plastic Welding Production (horizontal) 

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_Laser_Plastic_Welding_Production_horizontal.jpg (jpg - 1,44 MB)
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VITRION Foldable Glass (horizontal)

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

VITRION_Foldable_Glass_horizontal.jpg (jpg - 288,56 KB)
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NEXAR LIDE M 5000 schräg

NEXAR LIDE M 5000

Manual LIDE system for the semiconductor industry for panel formats. Laser Induced Deep Etching in a clean room production. 
 

Image author: LPKF Laser & Electronics SE.
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

NEXAR_LIDE_M_5000_schraeg_offen.jpg (jpg - 305,97 KB)
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NEXAR LIDE P 5000

NEXAR LIDE P 5000

LIDE system for High‑Volume Panel‑Level Production.
 

Image author: LPKF Laser & Electronics SE.
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

NEXAR_LIDE_P_5000_schraeg.jpg (jpg - 257,54 KB)
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LPKF CuttingMaster 2000 manual LIDE system for semiconductor panel processing in cleanroom

LPKF CuttingMaster 2000

Compact solution for depaneling PCBs.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF CuttingMaster 2000 (jpg - 561,90 KB)
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LPKF CuttingMaster 3000

for exact and extraordinary clean PCB laser depaneling.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF CuttingMaster 3000 (jpg - 520,97 KB)
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LPKF LoadingMaster 2000

Tailor made automation system developed by LPKF for laser depaneling. 

 

Image author: LPKF Laser & Electronics SE 
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LoadingMaster_2000_schraeg__2_.png (png - 18,32 MB)
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LPKF MicroCut 6080

Highest precision for wafer and flux stencils as well as filter applications.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_MicroCut_6080_schraeg__2_.png (png - 13,20 MB)
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Circuit board plotter LPKF ProtoMat S104

Circuit board plotter LPKF ProtoMat S104 for manufacturing of prototype circuit boards.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ProtoMat_S104_schraeg.png (png - 21,64 MB)
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LPKF ProtoLaser U4

UV laser system with a particularly wide range of applications.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ProtoLaser_U4_schraeg.png (png - 15,64 MB)
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LPKF ProtoLaser H4

für die Fertigung von Leiterplatten-Prototypen.

 

Bildautor: LPKF Laser & Electronics SE
Bildnutzung: Das Foto darf für Berichte unter Angabe der Quelle verwendet werden. Der Weiterverkauf an Dritte ist untersagt.

LPKF ProtoLaser H4 (jpg - 494,20 KB)
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LPKF PowerWeld 3D 8000

LPKF PowerWeld 3D 8000 laser plastic welding system for joining large 3D plastic parts.

 

Image credit: LPKF Laser & Electronics SE
Image usage: This photo may be used in reports provided the source is cited. Resale to third parties is prohibited.

PowerWeld_3D.png (png - 535,04 KB)
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Cutting Master 3290

LPKF CuttingMaster 3290

90-watt laser power with Tensor technology, suitable for thick substrates.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

CuttingMaster_3290_schraeg_rechts.jpg (jpg - 327,28 KB)
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Insights into Laser Processing

Technical articles in the LPKF TechFocus section showcase real-world applications, provide insights into processes, and highlight new technologies that help engineers and manufacturers push the boundaries of what is possible.

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Press & Public Relations
Product Communications
LPKF Laser & Electronics SE
Osteriede 7
D-30827 Garbsen
 
Fon: +49 (0) 5131 7095-0
Fax: +49 (0) 5131 7095-90
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