News & Press

LPKF press section –
news and image archive

Press Releases

Here we have listed our current announcements on technology and product innovations as well as IR press releases. Mandatory publications can be found in the Investor Relations section.

Garbsen, 13 May 2024 - The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE…
Garbsen, 13 May 2024 - The miniaturization of micro-chips is gradually reaching its physical limits. Chip manufacturers are forced to find new ways to…
• Sales and earnings in line with forecast, sales up 26% year-on-year • LPKF benefits from transformation in the semiconductor market • Measures to…
The Supervisory Board of LPKF Laser & Electronics SE has decided to extend the contract of Dr. Klaus Fiedler as CEO until 31 December 2028.

Digital Image Archive

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Glass Wafer 

produced with Vitrion.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_1507_Glas_Wafer_TF_003_1_.jpg (jpg - 6,40 MB)
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Circuit board plotter LPKF ProtoMat S104

Circuit board plotter LPKF ProtoMat S104 for manufacturing of prototype circuit boards.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF ProtoMat S104 (jpg - 743,40 KB)
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LPKF StencilLaser G 6080

LPKF StencilLaser G 6080 for cutting of SMT stencils and micro-cut parts.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF StencilLaser G 6080 (zip - 383,31 KB)
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Scientist in a laser experiment

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Scientist in a laser experiment (jpg - 203,47 KB)
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LPKF ProtoLaser ST

LPKF ProtoLaser ST for manufacturing of prototype circuit boards.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ProtoLaser_ST_schraeg.jpg (jpg - 339,56 KB)
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LPKF PowerWeld 3D 8000

Laser plastic welding System LPKF PowerWeld 3D 8000 for the joining of large 3D plastics parts.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Fig_1_PowerWeld3D.jpg (jpg - 609,38 KB)
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LPKF CleanCut Technology for Laser Depaneling

ensures technical cleanliness at the cutting edges and material savings of up to 30%.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF_CleanCut.jpg (jpg - 1,85 MB)
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LPKF PicoLine 3000 Ci

for exact and extraordinary clean PCB laser depaneling.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Produkt_Picoline_3000_Strich.png (png - 254,62 KB)
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Micro-chip

produced with LPKF´s LDS technology.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ICP_LDS_Microchip_Hand.jpg (jpg - 727,01 KB)
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Multilayer -

production and processing with LPKF´s machines.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF__Application_RP_TF_068_Multilayer.jpg (jpg - 673,03 KB)
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Progress in the production of a PCB -

production and processing in the laboratory with LPKF prototyping equipment.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF-Application_Ausschnitt_Board_Evolution.jpg (jpg - 751,53 KB)
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Laser cutting of flex material 

using LPKF´s machines.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF__Application_PCB__011_Flex.jpg (jpg - 887,48 KB)
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Production of automotive tail lights 

with LPKF´s patented laser plastic welding technology.

 

Image author: LPKF Laser & Electronics SE
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

_01_4031_Rueckleuchtenproduktion__.jpg (jpg - 313,47 KB)
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 Contact us to receive our press material or images

Press & Public Relations
Product Communications
LPKF Laser & Electronics SE
Osteriede 7
D-30827 Garbsen
 
Fon: +49 (0) 5131 7095-0
Fax: +49 (0) 5131 7095-90