Multilayer Circuit Boards

Multilayer solutions

Production of up to eight layers in-house

LPKF offers a complete prototyping product line for production of multilayers in an in-house lab. The multilayers are produced in three simple steps: structuring, lamination, and through-hole plating.

A printed circuit board composed of several layers

A multilayer is made up of multiple layers that are laminated together to form a printed circuit board. The outer layersof a multilayer are usually single-sided PCBs, whereas the inner layers are double-sided materials. Insulating layers, so-called prepregs,are inserted between the conductive layers. Up to four layers can be through-hole plated in a chemical-free process. For electrical connection of up to eight layers through-hole electroplating is recommended.

Three steps to a multilayer


An LPKF ProtoMat circuit board plotter or an LPKF ProtoLaser structures the traces on the base material using the layout data. Supported by automatic tool change and a camera for recording of fiducials, the system accomplishes this layer by layer – nearly automatically.


The structured layers are precisely stacked. Between the layers, “prepregs” insulate the traces on the different layers. During lamination the prepregs connect the layers. The LPKF MultiPress S hydraulic press performs the task of lamination– with perfect results, even for HF multilayers, thanks to preset process profiles.

Through-hole plating

The electrical connections between the individual layers form the final conductor structure. The LPKF ProtoMat circuit board plotter drills the through-holes. LPKF ProConduct is used for electrical connection – in a chemical-free process using a special conductive paste. For more than four layers, through-hole electroplating is recommended.

Systems for multilayer production

Allrounder for PCB Prototyping.

With the LPKF ProtoLaser S4, a structured printed circuit board can be produced from the layout within a few minutes – with exact geometries on numerous substrates.The ProtoLaser S4 can also reliably process copper areas with inhomogeneities of up to 6 µm in size and is ideal for manufacturing multilayers.

Specialist for RF and microwave applications.

The LPKF MultiPress S features a short pressing time of approx. 90 minutes and sophisticated temperature management. Storable pressure and temperature profiles provide optimum support for the user.

The electrical connections between the individual layers are made by LPKF ProConduct, a chemical-free system specially developed for laboratory use. If there are more than four layers, galvanic through-hole plating is recommended.


With multilayers, the connection of layers with vias is of particular importance. The classical galvanic process is obligatory for six layers or more. The LPKF Contac S4 table system is easy and safe to operate without chemical knowledge.


In-House Multilayer Technology (pdf - 508 KB)

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