Solutions for the semiconductor industry
Empowered by several decades of laser processing experience, LPKF offers leading-edge solutions with system benefits such as higher precision and yield as well as cost efficiency, supporting the ever ongoing trend towards miniaturization. The portfolio incorporates numerous features:
A new method to produce through glass vias (TGVs) helps to unlock the full potential of thin glass substrates Conductor tracks on epoxy mold Compounds (EMCs) and through mold vias (TMVs) enable new package design approaches Laser cutting and drilling of a wide range of materials are possible. The laser tool has become a necessity for applications on the micron scale.
Through glass vias (TGV)
Thin glass with a thickness of 50 µm to 500 µm is very suitable as a substrate material for high-density, high-frequency applications.
The new LIDE process from LPKF uses the laser as a noncontact precision tool for micromachining through glass vias with unrivaled productivity and quality.
Vitrion -- Your specialized glass foundry
Singulation of IC Packages
Materials used in the construction of IC packages are of great importance. Their physical, electrical, and chemical properties establish the foundation of the package, and ultimately its performance limits. LPKF's application and development teams have gained a deep understanding of laser drilling and cutting of both organic and inorganic substrates used in the electronics industry. The laser systems specifically tailored to the needs of the electronics industry are capable of cutting and opening or drilling a variety of IC compounds:
- Curved cuts with extremely fine outlines
- Clean side walls
- Virtually no burring
- Small heat-affected zone (HAZ)
- High positioning precision
Our engineers would be happy to support you in your evaluation phase as well during ramp-up and high-volume production. Learn more about what is possible.