Press Releases
Digital Image Archive
Glass Wafer
produced with Vitrion.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Management LPKF Laser & Electronics AG
Management of LPKF Laser & Electronics AG: Chief Executive Officer Dr. Goetz M. Bendele (left), Chief Financial Officer Christian Witt (right)
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Circuit board plotter LPKF ProtoMat S104
Circuit board plotter LPKF ProtoMat S104 for manufacturing of prototype circuit boards.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
LPKF StencilLaser G 6080
LPKF StencilLaser G 6080 for cutting of SMT stencils and micro-cut parts.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Scientist in a laser experiment
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
LPKF ProtoLaser ST
LPKF ProtoLaser ST for manufacturing of prototype circuit boards.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
LPKF PowerWeld 3D 8000
Laser plastic welding System LPKF PowerWeld 3D 8000 for the joining of large 3D plastics parts.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
LPKF CleanCut Technology for Laser Depaneling
ensures technical cleanliness at the cutting edges and material savings of up to 30%.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
LPKF PicoLine 3000 Ci
for exact and extraordinary clean PCB laser depaneling.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Micro-chip
produced with LPKF´s LDS technology.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Multilayer -
production and processing with LPKF´s machines.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Progress in the production of a PCB -
production and processing in the laboratory with LPKF prototyping equipment.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Laser cutting of flex material
using LPKF´s machines.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Production of automotive tail lights
with LPKF´s patented laser plastic welding technology.
Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
