Integrated economic efficiency
The ProtoLaser S4 is a valuable tool in the electronics laboratory. The compact laser system produces precise, fine structures for demanding PCBs in a very short time - as single pieces or small series, without masks or tools. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.
Large process window
The laser wavelength used opens up additional areas of application. The green laser (wavelength 532 nm) reduces the sensitivity to burns of the carrier substrate. The ProtoLaser S4 also processes plated-through boards with up to 6 μm strong inhomogeneities. In addition, the ProtoLaser S4 can economically cut and drill rigid or flexible substrates up to a thickness of 0.8 mm. Larger substrate thicknesses require more time.
The integrated high-resolution camera quickly and accurately detects register marks or conductor structures on the board.
Software in a package
The intuitive CAM software LPKF CircuitPro is pre-installed on the integrated computer. It optimizes CAD data for the laser process and offers comprehensive access to the process parameters. An extensive parameter library for many common and exotic materials supports the operator in his own projects.
Modern design for the laboratory
The LPKF ProtoLaser S4 packs smart solutions for operation and maintenance. The system fits on rollers through any laboratory door and makes no further demands on the laboratory apart from compressed air.
LPKF systems for Laser Structuring
Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.
Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.
The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.
The Tabletop system enables efficient prototyping of digital and analog circuits, RF and microwave PCBs -- even for multilayer PCBs. It achieves precise geometries on virtually any material with the laser tool. Precise drilling and milling even of thick substrates using mechanical drilling.