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10 recommended products comply with your requirements

Vitrion S 5000

LIDE production system for processing glass wafers for future packaging and semiconductor applications.

AMP 3000

The laser system for the AMP technology to electrically functionalize the real-estate of the Epoxy Mold Compound.

CuttingMaster 3000

The most precise laser depaneling systems with a large working area of 500 mm x 350 mm.

CuttingMaster 2000

Compact and extremely cost-efficient: Flexibility, space saving, design freedom - depaneling by laser opens up numerous potentials.

MicroCut 6080

The new benchmark for extremely small apertures in stencil sheets.

PowerCut 6080

Cuts thick metal sheets - up to 4 mm (150 mil) - with micrometer accuracy.

StencilLaser G 6080

The most productive and fastest cutting system for SMT stencils.

StencilLaser P 6060

The LPKF StencilLaser P 6060 is a state-of-the-art laser system for the production of SMT stencils.

PicoLine 5000

High-performance laser systems equipped with a large working area, CleanCut Technology and short-pulse technology. Variants for automated handling are available.

MicroLine 5000

The MicroLine 5000 is a cost-efficient laser drilling and cutting system with a large working area, specifically tailored to the needs of the PCB industry. The system is suitable for the singulation of IC Compounds.