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Vitrion S 5000
LIDE production system for processing glass wafers for future packaging and semiconductor applications.
The laser system for the AMP technology to electrically functionalize the real-estate of the Epoxy Mold Compound.
The most precise laser depaneling systems with a large working area of 500 mm x 350 mm.
Compact and extremely cost-efficient: Flexibility, space saving, design freedom - depaneling by laser opens up numerous potentials.
The new benchmark for extremely small apertures in stencil sheets.
Cuts thick metal sheets - up to 4 mm (150 mil) - with micrometer accuracy.
StencilLaser G 6080
The most productive and fastest cutting system for SMT stencils.
StencilLaser P 6060
The LPKF StencilLaser P 6060 is a state-of-the-art laser system for the production of SMT stencils.
High-performance laser systems equipped with a large working area, CleanCut Technology and short-pulse technology. Variants for automated handling are available.
The MicroLine 5000 is a cost-efficient laser drilling and cutting system with a large working area, specifically tailored to the needs of the PCB industry. The system is suitable for the singulation of IC Compounds.
The LPKF Fusion3D 1100 laser structuring system is a cost-effective entry into the 3D circuit market.
Equipped with a high-quality rotary indexing table, small, medium and large series of 3D circuit carriers can be produced particularly economically.
The LPKF Fusion3D 1500 combines the power of LPKF's high-performance structuring machines with the flexibility of a compact system.