LPKF Product Finder

LPKF NEXAR Bond 5000 enables direct glass-to-glass fusion with a fully laser-based process, no adhesives, low thermal budget, high-speed freeform welding.

Experience unprecedented precision and throughput with our comprehensive next generation NEXAR LIDE systems.

The LPKF NEXAR Ablate 5000 is the dedicated production system for glass core substrate singulation and edge preparation in advanced packaging.

The laser system for the AMP technology to electrically functionalize the real-estate of the Epoxy Mold Compound.

The most precise laser depaneling systems with a large working area of 500 mm x 350 mm.

Compact and extremely cost-efficient: Flexibility, space saving, design freedom - depaneling by laser opens up numerous potentials.

The new benchmark for extremely small apertures in stencil sheets.

Cuts thick metal sheets - up to 4 mm (150 mil) - with micrometer accuracy.

The most productive and fastest cutting system for SMT stencils.

The LPKF StencilLaser P 6060 is a state-of-the-art laser system for the production of SMT stencils.

High-performance laser systems equipped with a large working area, CleanCut Technology and short-pulse technology. Variants for automated handling are available.

The MicroLine 5000 is a cost-efficient laser drilling and cutting system with a large working area, specifically tailored to the needs of the PCB industry. The system is suitable for the singulation of IC Compounds.