Key specifications at a glance
- Glass wafer thickness: 0.3 to 3 mm
- Bridge tool: 150/200 mm wafer or 200/300 mm wafer
- EFEM: Two standard FOUPs
- Compatible with flat/notch wafers
- SECS/GEM for simple integration and configuration
- SEMI E84
- System dimensions (W x H x D): 1800 x 2200 x 3000 mm
Consulting and full-service support
Customers can rely on the LIDE expert and support team to accelerate the development of new solutions and shorten time-to-market.
Under the Vitrion brand, a full-service provider is available for all aspects of LPKF's LIDE technology. The team has an eye on the market dynamics and supports you in every phase of your LIDE-based innovation. For more information on LIDE technology and application examples, please visit www.vitrion.com.
Please feel free to contact us at any time. We look forward to your questions.