Greater Versatility and Efficiency for a Wider Range of Materials

Based on the MicroLine platform, LPKF has developed a solution for even higher demands on laser manufacturing quality: LPKF PicoLine. With this new laser system, LPKF meets the highest expectations regarding quality and cutting speed. The system increases yield and production efficiency in PCB processing – resulting in fast return on investment.

Equipped with a short pulse laser and LPKF CleanCut technology

The LPKF PicoLine 5000 stands for highly precise positioning and accurate processing of PCB material such as FR4, PI-, LCP- and PTFE-FPC, in all industry-standard panel sizes. Due to the cutting edge laser processing technology, the heat affected zone (HAZ) of the material becomes negligible. The convincing results: Clean cutting and precise vias – above industrial standards.

Technical Data

LPKF PicoLine 5000
Max. working area	533 mm x 610 mm (21" x 24")
Positioning accuracy	+/- 20 µm
Diameter of focused laser beam	25 µm
System dimensions (W x H x D)	1660 mm x 1720 mm x 1900 mm (66" x 68" x 75")*
Weight	ca. 2000 kg