LPKF PicoLine 5000

New benchmark in laser processing

  • CleanCut-Technology
  • Prepared for various automation variants
  • Large working area: 21” x 24” x 0.43” (X x Y x Z)

Greater Versatility and Efficiency for a Wider Range of Materials

Based on the MicroLine platform, LPKF has developed a solution for even higher demands on laser manufacturing quality: LPKF PicoLine. With this new laser system, LPKF meets the highest expectations regarding quality and cutting speed. The system increases yield and production efficiency in PCB processing – resulting in fast return on investment.

Equipped with a short pulse laser and LPKF CleanCut technology

The LPKF PicoLine 5000 stands for highly precise positioning and accurate processing of PCB material such as FR4, PI-, LCP- and PTFE-FPC, in all industry-standard panel sizes. Due to the cutting edge laser processing technology, the heat affected zone (HAZ) of the material becomes negligible. The convincing results: Clean cutting and precise vias – above industrial standards.

Technical Data

 PicoLine 5000
Max. working area533 mm x 610 mm x 11 mm (21" x 24" x 0,43")
Positioning accuracy+/-  20 µm
Diameter of focused laser beam  25 µm
System dimensions (W x H x D)1660 mm x 1720 mm x 1900 mm (66" x 68" x 75")*
Weightca. 2000 kg

* Height incl. status light = 2200 mm (87")

Images

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Brochure
LPKF PicoLine 5000 Series (pdf - 717 KB)
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