New benchmark in laser processing
- Prepared for various automation variants
- Large working area: 21” x 24” x 0.43” (X x Y x Z)
Greater Versatility and Efficiency for a Wider Range of Materials
Equipped with a short pulse laser and LPKF CleanCut technology
The LPKF PicoLine 5000 stands for highly precise positioning and accurate processing of PCB material such as FR4, PI-, LCP- and PTFE-FPC, in all industry-standard panel sizes. Due to the cutting edge laser processing technology, the heat affected zone (HAZ) of the material becomes negligible. The convincing results: Clean cutting and precise vias – above industrial standards.