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Thin Glass Processing

Utilize a Revolutionary
Technology
for Your Application

Deep features in thin glass

No special-glass needed, no chipping, no micro cracks

The Laser-Induced Deep Etching (LIDE) technology from LPKF makes it possible for the first time to realize modifications over the entire glass thickness with individual laser pulses. This is the basis for the generation of deep structures such as through holes or micro sections.

 Vitrion -- Your foundry for sophisticated thin glass substrates


Various concepts -- bundled under the Vitrion brand -- are available for the implementation of thin glass substrates with deep microstructures in your projects.

Vitrion enables prototyping and a series production service for a wide range of thin glass applications in a previously unattained quality. Use it to your advantage.

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