The Electronic Components and Technology Conference (ECTC) is the premier international event bringing together the best in packaging, components and microelectronic systems science, technology and education in an environment of collaboration and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
The technical program includes papers on the latest developments and technical innovations in packaging. Topics include advanced packaging, modeling and simulation, photonics, interconnects, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.