레이저를 사용한 회로 기판 프로토타입 제작

Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.

Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.

The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.

은다층 PCB 뿐만아니라, 디지털및아날로그회로, RF 및마이크로파 PCB의효율적인프로토타이핑을가능하게합니다. 레이저도구를사용하여거의모든재료에서정확한기하학적구조를만들수있습니다.  기계적드릴링을이용하여두꺼운기판도정밀한드릴링및밀링..