LPKF ProtoLaser H4

Enhanced Tabletop System for Fast PCB Processing

  • Quick surface processing on all common circuit board materials
  • Exact geometries thanks to contactless, scanner-based process
  • Precise drilling and routing of even thick substrates using mechanical drilling
  • Compact and safe tabletop system: lab-ready, class 1 laser
  • Easy operation using intelligent, intuitive system software LPKF CircuitPro RP
[Translate to Koreanisch:] LPKF ProtoLaser H4 Prototyping Laser System

Tabletop System LPKF ProtoLaser H4

Take your lab to the next level!

Combining the advantages of mechanical drilling of thick substrates including multilayers with extremely fast, contactless, laser surface processing.


Fast processing, wide range of materials, reliable process results in the laboratory!

This compact and economical solution is based on the proven concept of the LPKF ProtoLaser and LPKF ProtoMat systems. In combination with the LPKF CircuitPro software, it guarantees flawless operation based on your CAD data.

Plug & play, all-in-one, desktop entry level laser system, comes with built-in computer and software

Only power supply, compressed air and dust extraction need to be connected to process standard single and double-sided FR4 materials, some single-sided RF, PTFE or ceramic filled materials as well as certain flex substrates like Al on PET with 100 μm/50 μm line/space.

Flexible materials and foils can be freely positioned and fixed precisely on a vacuum table.


The vision alignment, material thickness measuring,  six mechanical tool positions as well as numerous  software-defined laser tools and a broad library of  predefined materials enable the LPKF ProtoLaser H4 to be operated with almost no user intervention.

Compact and efficient

The system requires only a power supply and compressed air. In operation, the LPKF ProtoLaser H4, which has a granite base, complies with laser class 1; thus, no further protective measures are required.



LPKF ProtoLaser H4 (pdf - 178 KB)
Rapid PCB Prototyping Product Catalog (pdf - 4 MB)
LPKF TechGuide Rapid PCB-Prototyping (pdf - 3 MB)

LPKF systems for Laser Structuring

LPKF ProtoLaser U4

Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.

ProtoLaser R4 -- picosecond laser

Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.

LPKF ProtoLaser S4

The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.

다층 PCB 뿐만아니라, 디지털아날로그회로, RF 마이크로파 PCB효율적인프로토타이핑을가능하게합니다. 레이저도구를사용하여거의모든재료에서정확한기하학적구조를만들있습니다.  기계적드릴링을이용하여두꺼운기판도정밀한드릴링밀링..


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