Enhanced Tabletop System for Fast PCB Processing
- Quick surface processing on all common circuit board materials
- Exact geometries thanks to contactless, scanner-based process
- Precise drilling and routing of even thick substrates using mechanical drilling
- Compact and safe tabletop system: lab-ready, class 1 laser
- Easy operation using intelligent, intuitive system software LPKF CircuitPro RP
Fast processing, wide range of materials, reliable process results in the laboratory!
This compact and economical solution is based on the proven concept of the LPKF ProtoLaser and LPKF ProtoMat systems. In combination with the LPKF CircuitPro software, it guarantees flawless operation based on your CAD data.
Plug & play, all-in-one, desktop entry level laser system, comes with built-in computer and software
Only power supply, compressed air and dust extraction need to be connected to process standard single and double-sided FR4 materials, some single-sided RF, PTFE or ceramic filled materials as well as certain flex substrates like Al on PET with 100 μm/50 μm line/space.
Flexible materials and foils can be freely positioned and fixed precisely on a vacuum table.
The vision alignment, material thickness measuring, six mechanical tool positions as well as numerous software-defined laser tools and a broad library of predefined materials enable the LPKF ProtoLaser H4 to be operated with almost no user intervention.
Compact and efficient
The system requires only a power supply and compressed air. In operation, the LPKF ProtoLaser H4, which has a granite base, complies with laser class 1; thus, no further protective measures are required.
LPKF systems for Laser Structuring
Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.
Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.
The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.