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Produce Circuit Board Prototypes in a Single Day

Laser Structuring of PCBs

Rapid PCB Prototyping

Production of
Laser Cut Stencils

SMT Stencil Technology

Profitable Laser Cutting
of PCBs / FPCs

PCB Processing Technology

Stress-free Laser Depaneling
of Assembled PCBs / FPCs

PCB Depaneling Technology

Solutions for Manufacturing
3-Dimensional Circuitry

MID Technology

Systems and Services for
Laser Plastic Welding

Laser Plastic Welding

Structuring of
Thin Film Solar Modules

Solar Cell Technology

News

Company News

Increasing performance in the 3rd dimension / LPKF improves Fusion performance
June, 29th 2010

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Trade Shows

European Microwave Week, France
September 26th - October 01st 2010, Booth 128

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Investors

Interim Report 01/2010

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Latest Ad-hoc Message

03.06.2010 / LPKF wins large order with new laser cutting systems (73 KB)

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Brochures

LPKF-LDS Process
PCB Laser Cutting
Depaneling of Assembled PCBs
SMT Stencil Cutting
PCB Prototype Structuring

Catalog

Rapid PCB Prototyping

Hermes Award 2010

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New Products

PCB Depaneling

The LPKF MicroLine 1000 S takes economical laser depaneling to a new dimension. It makes clean, burr-free cuts in FR4, FR5, CEM, ceramic, polyimide and other PCB substrates.
About PCB laser depaneling

Prototyping on Resist-Covered Substrates

The ProtoLaser LDI is a table top laser direct imaging (LDI) system for the production of microstructures on UV sensitive resist.

About laser structuring on resist