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Welcome to LPKF
ProtoMat S-series Header

Milling and Drilling of Printed Circuit Boards

Rapid PCB Prototyping

Laser Cut Stencils

Production of
Laser Cut Stencils

SMT Stencil Technology


Profitable Laser Cutting of PCBs / FPCs

Profitable Laser Cutting
of PCBs / FPCs

PCB Processing Technology

Stress-free Laser Depaneling of Assembled PCBs / FPCs

Stress-free Laser Depaneling
of Assembled PCBs / FPCs

PCB Depaneling Technology

LDS Circuitry

Solutions for Manufacturing
3-Dimensional Circuitry

MID Technology

Laser Plastics Welding

Systems and Services for
Laser Plastic Welding

Laser Plastic Welding

Thin Film Solar Module Production

Structuring of
Thin Film Solar Modules

Solar Cell Technology

News Investors

Conference Call - Q1/2012 Presentation

PDF download

Annual General Meeting 2012

Information and downloads are available now

Interim Report Q1/2012

PDF download

Financial Report 2011

PDF download

Current Declaration

Declaration of Compliance 2011

Quicklinks

Current Share Price
Financial Calendar
Subscribe to Financial News
Downloads
New Products

The laser processing of PCBs

The laser depaneling system ensures highly precise processing results during industrial laser processing.

The new MicroLine 6000 P - Model 2012

Micro-material processing with laser systems

ProtoLaser U3The ProtoLaser U3 is ideal for the creation of high quality prototypes, the production of small batches, and the manufacture of individual components with a large degree of customization.

UV laser for development work

                                       
LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90
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