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Rapid Prototyping EquipmentIC Packaging EquipmentSMT Stencils Laser EquipmentPCB Processing EquipmentPCB Depaneling EquipmentLPKF LDS Equipment

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Rapid PCB Prototyping
Systems for the production of PCBs and multilayer boards with up to six layers.

IC Packaging
Production of glass interposers with high-speed laser processing.

Stencil Laser Equipment
Laser production of SMT stencils and quality check with inspection systems.

PCB Processing Technology
Cutting and drilling of printed circuit boards (PCBs) for highest requirements.

PCB Depaneling Technology
Depaneling of printed circuit boards (PCBs) for highest requirements.
Laser-Direct-Structuring (LDS)
Laser structuring of circuit layouts on 3D injection molded plastic parts.

Solar Equipment
Laser systems featuring fast and precise structuring of thin film solar cells.

Laser Welding Equipment
Innovative laser systems for plastic parts welding.

Motion Control Technology
Quick and precise axis controllers form the basis for the efficiency of our systems.


More information
LPKF Laser & Electronics AG
 
Osteriede 7
30827 Garbsen
Germany
 
Tel.:
+49 (0) 5131 7095-0
Fax:
+49 (0) 5131 7095-90
E-Mail:
Contact form


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