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LPKF-LDS Process

Producing MIDs (Molded Interconnect Device)


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Since 1997, LPKF has developed MID technology as a laser-based procedure for the production of MID’s (molded interconnect devices) called: The LPKF-LDS™ Process.

With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on complex three-dimensional carrier structures. The laser beam structures the layout directly into the molded plastic part. As a result, weight and fitting space can be effectively reduced. Your design teams enjoy complete 3D capability on freeform surfaces and great freedom for redesigns. Thus LPKF-LDS™ opens up new possibilities.

Animation Laser Direct Structuring Process




Brochure LPKF Laser Direct Structuring for 3D Molded Interconnect Devices


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