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Glass Processing with the LPKF ProtoLaser R

June 2017
As the new YouTube film from LPKF demonstrates, “glass is no longer transparent,” but can be processed “cold” using special laser technology. Glass and other heat-sensitive materials with properties especially compatible with electrical circuits can now be cut, ablated, or structured in a damage-free process.
 
Picosecond pulses: 0.9-mm holes in 50-µm-thick glass
Picosecond pulses: 0.9-mm holes in 50-µm-thick glass
The tool for this is the new LPKF ProtoLaser R – the first compact laboratory laser with an ultrashort-pulse laser source. In cold laser micro material processing, the pulse width plays an important role: the shorter the processing pulse, the smaller the amount of heat input into the sensitive material. In the picosecond range, there is virtually no heat transfer and the targeted material evaporates immediately. For cutting applications, a stable power of up to 4 W is sufficient. With the USP laser, complex thin-film systems and temperature-sensitive substrates can be ablated or structured without the use of masks or films.

To the YouTube video
 
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