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MacDermid develops firmer, faster electroplating for LDS

October 2011
MacDermid, the international company specialized in chemicals, has developed an innovative copper-plating method for LDS components. It is a currentless copper-plating process which, unlike the conventional methods to date, consists of a single copper bath.
 
The metallization developed by MacDermind increases productivity
The faster copper bath which is also more selective to LDS structures replaces the coating method often used in laser structuring ABS and PC/ABS materials, which consisted of two steps, the initial layer (strike) and build-up layer (full build). The metallization reduces amount of work and the equipment required, increasing productivity. The manufacturer estimates the savings potential of the new "MID Copper 100 B1" copper-plating method to be about 20 percent of metallization costs.

Contact at MacDermid is John Swanson, Managing Director Electronics Packaging.
 
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