Three-dimensional molded interconnect devices (MID) have been used in cell phones for some time, but recently laptop manufacturers have also been equipping their mobile computers with antennas manufactured with the LPKF LDS method. The reason is easy to explain:
 
Dwindling laptop sizes and weights result in more and more casings being manufactured from magnesium alloys. This results in a shift in the installation space of antenna modules. The trend is moving towards LDS antennas since these are more powerful than conventional laptop antennas. The high functional density, compactness and high flexibility make LDS antennas are ideal for providing top data transfer speeds.

They feature a length to 300 millimeters and are ideally structured with an LPKF Fusion3D for mass production. LPKF Laser & Electronics AG offers practice oriented and economical solutions for implementing the systems necessary for accommodating components.