September

Häcker Automation GmbH was present at the SMT-Hybrid-Packaging with two Vico-520 series assembly systems. By own account, the specialist in 3D-Multi-Chip assembly can account for three successful trade fair days. The production lines for 3D/MID micro-assembly featured various expansion modules from the building set currently totaling 65 tools.read more...

Essemtec, worldwide manufacturer for processing systems in the field of SMT mass production, has developed a production system for dispensing and assembling three-dimensional interconnect devices.read more...

The Dresden plant construction firm XENON, a worldwide leading supplier of fully automated production equipment for mechatronics systems, introduced its 3D assembly module for MID assemblies at the SMT-Hybrid-Packaging trade show in Nuremberg.read more...

The middle of this year LaserMicronics GmbH moved into a new production building in close vicinity to the LPKF Laser & Electronics AG headquarters in Garbsen. Their new gem is the electroless plating line designed for the LDS method.read more...

The executive board and research advisory council at the research society 3-D MID e.V. assembled for a regular meeting at LPKF Laser & Electronics AG in Garbsen early July. Several new research projects were determined:read more...

Automotive, medical technology, consumer goods – which new products are made possible by laser welding plastics, the benefits of the new technology, are illustrated by a new LaserMicronics video.read more...