Häcker Automation GmbH was present at the SMT-Hybrid-Packaging with two Vico-520 series assembly systems. By own account, the specialist in 3D-Multi-Chip assembly can account for three successful trade fair days. The production lines for 3D/MID micro-assembly featured various expansion modules from the building set currently totaling 65 tools.
 
Häcker has been active in the market of 3D assembly systems since 2001. The fully automated systems have proven themselves in mass production many times where they are especially marked by a high level of precision and flexibility.

Key elements of the Vico systems are the 3D substrate intake and the 3D-capable image recognition system. The two spatially flexible axle systems feature a positioning accuracy of +/- 10μm. The 3D-Vision image recognition system based on two cameras angled toward each other is perfectly suited for accurately measuring and visually inspecting three-dimensional components. The components are visually recognized, possible positional tolerances are automatically corrected. The 3D substrate intake is suitable for concave and convex 3D-MID components. The clamped MID is optimally positioned for assembly and dispensing through turning (>360°) and tilting (>90°).