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9. International MID Congress

May 2010
The Research Association Molded Interconnect Devices 3-D MID e. V. will focus its topics on products, manufacturing processes, manufacturing technologies and introduction strategies at the 9th MID Congress in Fuerth. This year the internationally accepted MID forum will be held on September 29th and 30th at the Fuerth Congress Center.
 
Logo 3D-MID eV
Source: Research Association Molded Interconnect Devices 3-D MID e.V.
As usual, the event will provide MID manufacturers, research institutes and users with an opportunity for intense exchange of knowledge and experience. The research association 3-D MID e.V. will allude to its latest research projects at this event. An extensive industry exhibit is planned in the exhibit area to complement the congress. Ellen McMillan, Director at the leading LDS manufacturer Molex, will present her principles on MID.
 
Stay updated
9th International
Congress MID 2010
29th - 30th September 2010
Congress center of Fuerth

www.3d-mid.de


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