Prospects had an opportunity to learn more about the LPKF product spectrum at the SMT Hybrid Packaging in Nuremberg. The trade fair is Europe’s largest trade event for system integration in micro-electronics.
 
At this year’s specialty trade fair, LPKF Laser & Electronics AG introduced the laser system MicroLine 6000 S live. The fully automated system for stress-free, ultra-precise cutting of assembled PCBs was on display at the joint booth “Future Packaging” in hall 6, staffed by the Fraunhofer IZM. The live production line with multiple production cells was dedicated to “PCB Packaging for Medical”. Even its little brother, the MicroLine 1000 S, was on exhibit. A smaller work area makes the system significantly more compact. Experts explained the distinctive features of individual production processes on the system line several times each day.

Information about LDS as well as samples are available to trade fair attendees at the LPKF Laser & Electronics AG booth (Hall 6, Booth 320). In addition, LPKF will provide information about the latest developments in PCB prototyping, SMT stencil technology and PCB machining at the SMT. You will be able to see the LPKF ProtoLaser S, the LPKF ProtoMat S62 as well as other PCB Prototyping systems and an additional laser system for cutting assembled and unassembled PCBs.