A new twelve-page brochure on the principles and areas of application of the LDS method is now available free of charge from LPKF Laser & Electronics AG. Available in German and English, the brochure presents examples of products and innovative areas of application. Click on the right-hand column to download the brochure “3D-MIDs – laser direct structuring for injection molded circuit carriers”.
Brochure on LPKF LDS™
Newsletter > Archive LDS Newsletter
