April

The new laser-structured LPKF Fusion3D 1200 already caught the attention of trade visitors to electronica in Munich in November 2014 – now it will be on display from May 5-7, 2015, at SMT Hybrid Packaging 2015 in Nuremberg, Europe’s leading event for system integration in microelectronics.read more...

Every year, Festo AG is a huge draw at the Hannover Messe thanks to its innovative bionic technology concepts. This time they have butterflies and ants – perfectly suited to the trade fair theme: “Integrated Industry – Join the Network.”read more...

Radio-based vehicle networking is gaining in importance. There is a constantly growing demand for GNSS (Global Navigation Satellite System) navigation, Internet transmission, and vehicle-to-vehicle communication, with technical specifications becoming more and more complex. read more...

Innovative construction methods for coil bodies have become essential as their required sizes are constantly shrinking and assembly density increases. NORWE, a leading manufacturer of coil bodies, uses LDS technology and the material competency of LPKF and Laser Micronics to develop new, optimized products. read more...

SMT/Hybrid/Packaging 2015 – Europe’s leading event for system integration in microelectronics – is taking place at the Nuremberg Trade Fair Center from May 5-7. Visitors can take a look at the advantages of printed circuit board prototyping with the aid of the ProtoLaser U3 at the LPKF stand (Hall 7, Stand 144). read more...