2013

On June 19, 2013, the FAPS TT workshop, “3-D MID Applications: Design – Production – Reliability”, will take place in Nuremberg. The specialized talks address all aspects of the 3-D MID process chain and provide a comprehensive overview of the development and current state of the technology.read more...

The 3-D MID Research Association had a joint stand at this year’s SMT Hybrid Packaging in Nuremberg (Apr. 16 - 18, 2013). The network of companies and institutes at stand 7-810 offered information about the current situation and future trends in MID technology and the latest serial applications. read more...

LPKF has obtained a mutual settlement in its dispute regarding patent infringement with its customer PATRON CO. LTD, Korea, and has thus sent a clear signal to the market. PATRON thus affirmed that it would produce LDS components exclusively with machines that are from LPKF. read more...

In June 2013, a new LDS paint will be coming onto the market. The dual-component paint is suitable for serial production and can be applied to conventional plastic components that are not LDS-capable.read more...

On September 25 and 26, 2013, the MID Forum takes place in the Chinese city of Shanghai. LPKF customers in China and other countries, MID manufacturers and numerous German companies are giving presentations at this year’s MID Forum.read more...

With 3-D molded interconnect devices (MIDs), miniaturized and highly integrated systems are implemented. In the professional workshop “3-D MID applications: design – manufacturing – reliability,” there are practical demonstrations in the laboratories, alongside talks and professional discussions.read more...

At the Electronica 2012 in Munich, a novel LDS-based lighting system attracted a lot of attention at LPKF’s stand. Marketed under the name Homelight, the LED systems manufactured by MOLEX uses flexible solid state lights (SSLs) that adhere magnetically to carrier rails and can be shifted, removed or replaced at any time. read more...

The materials specialist PTS has developed an innovative plastic on the basis of PA 6.6 polyamide. It can be cross-linked by irradiation due to its crystalline and amorphous components.read more...

Already 51% of all smartphones are manufactured with LDS – that’s what a new infographic  (version: 12/2012) says about the current proliferation of LDS technology in the various markets. In smartphone telephony, LDS is especially used with antennas. read more...

A new interactive showroom illustrates what is required in the laboratory and production facility for the laser direct structuring (LDS) process. The LDS laboratory for example shows a computer workstation where the layouts of MIDs are created with 3-D CAD software.read more...