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Twin pack: 3D-MID Technology Exchange Conference in China and JMID Annual Meeting in Japan

August 2013
Premiere: on September 25 and 26, 2013, the first “3D-MID Technology Exchange Conference” MID forum will take place at the Four Point Sheraton Hotel in Suzhou. Following the opening ceremony for the founding of the Chinese MID association, experts from all areas that utilize MIDs will present solutions along the entire process chain. The latest applications, advances and future market trends in the 3D-MID environment will also be presented.
 
Logo 3D-MID eV
The first “3D-MID Technology Exchange Conference” MID forum takes place in September (source: 3-D MID Research Association).
The international event is supported by the 3-D MID Research Association. The participants can also see an industry exhibit on the topic of MIDs. The event, at which up to 300 participants are expected, is a specialist forum for European and Asian MID partners. The opening ceremony is held by Prof. Yewen Zhang (Director of Committee, Molded Interconnect Devices Committee of FSZI).

The MID industry in Asia is organizing and asserting itself ever more vigorously. Thus, the Japanese JMID association, the Japan MID Association founded in 2002, is advocating through various activities for the MID industry to obtain an even stronger presence in the market. On October 11, 2013, the Japan MID Association will hold its JMID Annual Meeting at the Institute of Industrial Science, University of Tokyo. In the past few years, many new technologies for MID manufacturing have been introduced and exchanges have been promoted with foreign associations.
 
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