May

On September 25, 2013, the “Three-dimensional Arrangement of LEDs – Innovative Production Technologies” workshop will take place in Bregenz, Austria. The workshop will explain how three-dimensional light sources can be produced for various areas of use (SSL, automobile lights, etc) with the LDS process. read more...

LPKF has developed an experimental LDS coating powder that can be used for metal surfaces. Up to now, only components made of LDS-capable plastic could be used in the LDS process.read more...

The 3-D MID Research Association has given the companies 2E mechatronic and OSRAM Opto Semiconductors the 2013 MID Industry Award for an innovative OLED lighting element. The award is given every two years for trend-setting products in the area of injection-molded interconnect devices at the “SMT Hybrid Packaging – System Integration in Microelectronics” trade fair. read more...

The Swiss company Cicor Printed Circuit Boards (PCB) has developed an innovative plug connector module that already integrates the contact support or insulating body. The design is so sophisticated that the same modules can be used for plug and socket. read more...

3-D Electronic Devices (3-D MIDs) – that’s the title of a new standard work that appeared in March 2013. The technical guide gives an overview of the latest research in 3-D MID technology along the entire process chain. It presents systems for targeted development of MID components, among other things, and highlights the multifaceted areas of use for this technology on the basis of successful serial applications.read more...

On June 19, 2013, the FAPS TT workshop, “3-D MID Applications: Design – Production – Reliability”, will take place in Nuremberg. The specialized talks address all aspects of the 3-D MID process chain and provide a comprehensive overview of the development and current state of the technology.read more...