3-D Electronic Devices (3-D MIDs) – that’s the title of a new standard work that appeared in March 2013. The technical guide gives an overview of the latest research in 3-D MID technology along the entire process chain. It presents systems for targeted development of MID components, among other things, and highlights the multifaceted areas of use for this technology on the basis of successful serial applications.
 
Developers and innovation managers gain insight and inspiration through exciting case studies. In comparison to the last edition of this book in 2004, it turns out that in the past few years numerous new processes have been developed, innovative applications have been tested and, in particular, the LDS processes have also been integrated. The technical guide is valuable for both experts and newcomers in the area of MID and is available to members of the Research Association Molded Interconnect Devices 3-D MID at the  preferential price of 129.99 euros, plus shipping costs.

The editor is Prof. Jörg Franke, who holds the chair in Factory Automation and Production Systems (FAPS) at the Friedrich Alexander University in Erlangen-Nuremberg and is Chairman of the Research Association Molded Interconnect Devices 3-D MID. The publication was collaboratively produced by employees of his institute and other MID experts.