April

The 3-D MID Research Association had a joint stand at this year’s SMT Hybrid Packaging in Nuremberg (Apr. 16 - 18, 2013). The network of companies and institutes at stand 7-810 offered information about the current situation and future trends in MID technology and the latest serial applications. read more...

LPKF has obtained a mutual settlement in its dispute regarding patent infringement with its customer PATRON CO. LTD, Korea, and has thus sent a clear signal to the market. PATRON thus affirmed that it would produce LDS components exclusively with machines that are from LPKF. read more...

In June 2013, a new LDS paint will be coming onto the market. The dual-component paint is suitable for serial production and can be applied to conventional plastic components that are not LDS-capable.read more...

On September 25 and 26, 2013, the MID Forum takes place in the Chinese city of Shanghai. LPKF customers in China and other countries, MID manufacturers and numerous German companies are giving presentations at this year’s MID Forum.read more...

With 3-D molded interconnect devices (MIDs), miniaturized and highly integrated systems are implemented. In the professional workshop “3-D MID applications: design – manufacturing – reliability,” there are practical demonstrations in the laboratories, alongside talks and professional discussions.read more...