The 3-D MID Research Association had a joint stand at this year’s SMT Hybrid Packaging in Nuremberg (Apr. 16 - 18, 2013). The network of companies and institutes at stand 7-810 offered information about the current situation and future trends in MID technology and the latest serial applications.
 
A live production line that demonstrated to the trade fair guests the entire MID process chain, from design to assembly or to the finished end product, was especially well received by visitors.

Another novelty at the SMT was the MID forum. Experts in industry and science gave talks there during the entire period of the trade fair and provided exciting insights into specialist MID technology topics such as innovative material use or 3-D assembly. Professionals from LPKF also gave talks on topics such as the market and use potentials for LDS technology and about the possibilities of ProtoPaint and ProtoPlate LDS for production of MID prototypes. A talk about the “Development of novel high-output LED systems on the basis of heat-conducting plastics” (Florian Ranft / LKT, University of Erlangen-Nuremberg, Apr. 16) was particularly interesting, given that these materials are so important for LED applications.

For companies that are still not very familiar with MID technology, there was a good chance to get an overview of this topic at the SMT. It also put the trade fair participants in a position to get to know or deepen their knowledge of the individual areas of application for MID technology.

A highlight at the SMT 2013 was the presentation of the MID Industry Award (Apr. 17). The award given by the Research Association Molded Interconnect Devices 3-D MID recognizes trend-setting, innovative products in the area of injection-molded interconnect devices. This year the MID Industry Award went to 2E mechatronic and Osram Opto Semiconductors for their OLED modul application.