The 2014 11th International Congress on Molded Interconnect Devices was held on September 24–26, 2014, in Fürth, Germany. The trade forum established by the Research Association Molded Interconnect Devices 3-D MID e.V. in cooperation with the University of Erlangen-Nuremberg is a globally recognized platform for MID technology.
 
With more than 260 participants from 15 countries, the congress once again provided a lasting impetus for promotion of the innovative technology of MIDs.

This year’s congress focused on numerous applications for mass-produced parts – proof of the popularity of MID technology in diverse product areas. With a total of 42 expert talks, an accompanying exhibition, and visits to leading research institutes, participants had ample opportunity to learn about alternative manufacturing processes and the potential of MID technology.

The talk given by Dr. Martin Giersbeck in the opening session was met with great interest. The vice-president of Robert Bosch GmbH spoke on the “potential of plastics technology for innovative mechatronic products.” The presentation address given by Dr. Oliver Klemp (BMW AG) and Engineer Aline Friedrich (Leibniz Universität Hannover/HFT) on “3D-MID antenna design for automotive applications” was equally interesting.

The world’s biggest assembly system manufacturer, Fuji, presented a new machine concept – showing that development of three-dimensional assembly and dispensing is advancing internationally, too. According to Uwe Schulz (Häcker Automation GmbH) in his talk on a “new platform for high-volume MID assembly,” state-of-the-art assembly machines can reach up to 40,000 process steps per hour.

Michael Bisges from Plasma Innovations then discussed another highlight, presenting a new process for 3D plasma coating with laser support. Laser Plasma Patterning (LPP) is especially recommendable for LED, lighting, and high-power applications thanks to possible coating thicknesses of 35–100 µm and a minimum trace width of 100 µm.

Overall, this year’s MID congress once again confirmed that large international companies and corporations are “on board” when it comes to presenting the latest MID developments and materials as well as MID-supported systems technology, process monitoring, and manufacturing processes. MID applications have long grown out of their reputation as a “European” trend and are now increasingly used throughout the world. This was also documented in Session 6, “MID International,” which included presentations from members of MID associations in countries and regions such as China, Japan, and Scandinavia.

The next, 12th, International Congress on MIDs will be held in 2016, again in the greater Nuremberg region.