January

The new LPKF ProtoLaser 3D presented at Productronica 2013 in Munich completes the process chain for LDS prototyping. With the products ProtoPaint LDS paint, ProtoLaser 3D, and ProtoPlate LDS, complete 3D MID prototyping – often in just a single day – will be possible in the future. read more...

A host of international events were organized to address the current state of the market and future for molded interconnect device (MID) technology, starting off with the first Chinese MID forum, held on September 25–26, 2013, in Suzhou, near Shanghai. read more...

Raschig GmbH of Ludwigshafen and LPKF Laser & Electronics AG have developed new high-performance LDS materials based on thermosetting epoxy resins in a joint pilot project. The impetus for this project was provided by the fact that copper and the thermoplastic LDS plastics, especially the partially crystalline materials PET/PBT, PA 6/6T, and PPA, exhibit different thermal expansion coefficients. read more...

LED developers can look forward to two interesting events in February. The MID workshop organized by FAPS-TT is directed at developers and users in industry. The one-day event will be held in Nuremberg on February 13, 2014. “New Possibilities for Three-dimensional LED Lamp Design” is the title of the presentation that LPKF will give at the “Strategies in Light” conference in Santa Clara, USA, on February 27, 2014.read more...