2012

Unfortunately, with the success of LDS technology the number of cases in which the patented process is improperly used is also growing. Recently, electronics manufacturers have been increasingly offered inferior LDS components, so that LPKF has decided to pursue more vigorous legal proceedings against patent infringements. This also serves the interest of customers who have high expectations for LDS technology.read more...

The MID conference in Fürth is regarded as the leading MID forum worldwide for experts and beginners alike. The 10th MID conference will take place on September 19 and 20. read more...

It doesn’t always have to be black: the Mitsubishi Engineering-Plastics Corporation (MEP) brings color into play in manufacturing MID components. Under the brand name Xantar, MEP has brought individually colorable LDS plastics based on PC and PC/ABS onto the market.read more...

The first LDS Technology Day in the Bavarian town of Wiesau met with a great response. Nearly 150 developers and users took the opportunity at the beginning of March to learn about current developments in the area of 3-D MID. The LDS applications presented met with particular interest among the participants.read more...

The thermal diaphragm flow sensor which received the MID Innovation Award will go into series production this year. The sensor developed jointly by 2E mechatronic, HSG-IMIT, MMA AG and Gruner AG is able to exactly measure even the smallest differential pressures. The component is used in enclosure technology with air volume control in air conditioning systems.read more...

The highlight at the joint stand of the 3D MID “SMT Hybrid Packaging 2012” on May 8-10 in Nuremberg was a production line that reproduced live the entire 3D MID process chain, including injection molding and fitting under conditions of series production.read more...