October

The 10th MID Conference in Fürth met with enormous interest in professional circles. The number of presentations reached a record level. The Research Association Molded Interconnect Devices 3-D MID e.V. expanded the two-day convention program, with three series of presentations taking place parallel to one another. The “industrial track” showcased MID technology developments from an industrial perspective; the “scientific track” did so from a scientific perspective. read more...

Since this September, Ensinger Compounds in Nufringen, near Stuttgart, has been a new licensee of LPKF. Starting immediately, Ensinger is preparing a new LDS-capable polyetheretherketone (PEEK). The high-performance plastic is extremely temperature-resistant and in addition has outstanding chemical resistance. read more...

Stephan Krause became a new member of the LPKF team at the beginning of August. As a strategic product manager, Krause looks after the area of market analysis for LDS applications, among other things. read more...

It is well-known that LDS applications require less space and weight. But can the use of this technology speed up the market launch of a product? The following infographics describe the effect LDS has on the market launch.read more...

There are three events between October and December for those interested in MID to learn new things, expand their knowledge or make contacts. It starts off with the Cicor Symposium and the ΣYSTEMS INTEGRATION in Germany and Switzerland, followed by PEP's Innov' Day in France.read more...