Whether in telecommunications, automotive and sensor technology, logistics or consumer electronics - LDS MIDs know hardly any limits. The technology is especially widespread in the production of smartphone antennas. In addition, ever more new applications are coming onto the market.
 
The latest examples are LED lighting systems for residential interiors and the automobile industry. They benefit from the flexible and precise LDS process which allows further functions in a tighter space and shortens product cycles.

Next, even finer structures will be possible on the LDS MIDs. A newly designed laser head should give new impulses to sensor packaging, among other things. At the same time, LDS components are becoming more and more attractive in the visual area. We are developing a new process that will provide for substantially smoother surfaces. A consortium is preparing new heat-conductive plastics which discharge the heat from the plastic component in a controlled fashion. With plug elements, in the future manufacturers will be able to fall back on galvanically reinforced strip conductors – a real advantage for the LDS process here. And since we've had very good experiences in the logistics area with RFID, we are sure that LDS will also be used with NFC. Near field communication is one of the big topics in the coming years – just think of micropayment.

Those who are curious about this now will only have to wait until the next electronica, the leading world trade fair for systems and applications, where we will present some of these developments in mid-November.