The highlight at the joint stand of the 3D MID “SMT Hybrid Packaging 2012” on May 8-10 in Nuremberg was a production line that reproduced live the entire 3D MID process chain, including injection molding and fitting under conditions of series production.
 
A part of this “accessible manufacturing” was an LPKF laser system in the Fusion3D-1000 line for structuring printed circuit board structures on component surfaces. In the following step, the plastic part was metallized with LPKF ProtoPlate so that a fully fledged 3D interconnect device is produced.

Besides of the 3D MID joint stand LPKF Laser & Electronics was also involved in the “Future Packaging” joint stand in hall 6 at stand 434. The “SMT Hybrid Packaging” production line could be seen there with the LPKF MicroLine 6000 S laser system, which separates populated printed circuit boards from larger panels without sensitive structures or components being stressed.

The MicroLine 6000 S is ideal for printed circuit boards with a high level of mixed placement. Alongside the production line, there will be also be an exhibition on a number of topics to help illustrate the main features of the line. The line will be run under the motto “Strong performance – from zero to production in three days” and is being organized by the Fraunhofer Institute for Reliability and Microintegration.