MID flow sensor about to go into series production
Electric strip conductors and fluid connections are integrated in the MID with the sensor element, which leads to a clear reduction of installation space as compared to conventional flow sensors. The electrical contact between chip and MID is achieved through wire bonding.
The entire flow sensor can be soldered like an electronic SMD on printed circuit boards. The enclosure of the sensor consists of the Vectra® E840i LDS, specifically developed for the LDS process, a liquid crystalline polymer (LCP) from Ticona.
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