The first LDS Technology Day in the Bavarian town of Wiesau met with a great response. Nearly 150 developers and users took the opportunity at the beginning of March to learn about current developments in the area of 3-D MID. The LDS applications presented met with particular interest among the participants.
 
For example, the vehicle manufacturer Audi presented an LDS prototype which as a carrier of combination instruments itself was fitted with LEDs. Kunststoff Helmbrechts (KH) and MID-TRONIC are cooperating in the development and production of the “MyWave 3D” functional component. The multifunctional device shown for the first time at the LDS Technology Day combines a 3-D LDS printed circuit board with a 2-D printed circuit board under a three-dimensional curved decorative enclosure.

Dr. Wolfgang John, Director of LDS Process Development at LPKF, sketched the rapid development of the LDS process in the past few years. For the future, he expects further developments with heat-conductive plastics, improved solderability, housing through laser-plastic welding and reduction of strip conductor width and insulation channels to values < 50 µm, according to John.

At the conclusion of the gathering, the participants at the LDS Technology Day emphasized the successful combination of theory and practice. The event took place at the invitation of LPKF Laser & Electronics AG, Essemtec AG and MID-TRONIC Wiesauplast at MID-TRONIC’s new premises.