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SinglePico Lasertechnology
The new LPKF PicoLine laser systems by LPKF Laser & Electronics are the ideal solution for high-quality, precise and residue-free processing of rigid, rigid-flex or flex circuitry.read more...

MicroLine 2000 Ci
Due to the continuing trend towards miniaturization and ever greater packing densities in the PCB sector, precision laser technology has become the standard technology for depaneling in recent years. At SMT in Nuremberg, LPKF Laser & Electronics will be demonstrating why many companies now rely exclusively on laser systems such as LPKF MicroLine - and thus save resources and improve yields.read more...

LPKF InlineWeld 6200

Safe welding of Plastic components

LPKF InlineWeld 6200 laser welding system for medical technology materials

06/Apr/2018
Clean, fast, flexible, cleanroom compatible and reliable: for the first time, LPKF Laser & Electronics is presenting laser systems for plastic welding at MT-Connect. These systems allow safe, hygienic and hermetically sealed connections between plastic components - without (chemical) additives or particles and with low mechanical component stress. The technology is used, for example, in the joining of plastic housings or geometric bodies as well as in microfluidics.read more...

LPKF ProtoPlace S

Create printed circuit boards easily in-house

LPKF shows at Embedded World 2018, Nuremberg, how this can be realized

15/Jan/2018
Many developers dream of having a finished printed circuit board in their hands just a few hours after the first idea. At Embedded World 2018 in Nuremberg, the laser technology specialist LPKF Laser & Electronics will be demonstrating how quick and easy in-house prototyping can be implemented.read more...

LPKF Vitrion 5000

Technology for micro processing of glass awarded

LPKF Laser & Electronics AG receives the Productronica Innovation Award 2017 in the semi-conductor category for LIDE technology

15/Nov/2017
With the LPKF Induced Deep Etching (LIDE) laser from LPKF, the expert jury of Productronica honors a process that unlocks the full potential of glass for microsystems technology. The LIDE process is a combination of laser modification and wet chemical etching.read more...

 
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