Press Releases

Garbsen, June 2008 – LPKF laser systems have significantly improved production reliability in the manufacture of modern electronic subassemblies. The non-touch laser process replaces mechanical methods when cutting flexible and rigid PCBs – sensitive components and solder connections are protected from possible damages.read more...

Garbsen, April 2008 – The new LPKF StencilLaser G 6060 is a fully enclosed laser cutting system for SMT stencils. The small footprint and light weight construction makes the system ideal for any environment. The system allows for high performance speeds up to 17,400 apertures per hour; three times faster than legacy stencil cutting systems.read more...

Garbsen, March 2008 – The LPKF MultiCut is a powerful laser cutting system for manufacturing microparts to a professional standard. This system can be used to cut any contours in a range of materials from 30 µm to 2 mm thick. With an accuracy of ±2 µm, reproducible quality is guaranteed every time.read more...

Garbsen, March 2008 – The LPKF-LDS Method produces electronic circuits directly on three-dimensional injection-moulded plastic parts. The laser process allows fast and flexible design changes, and can produce more precise structures than conventional MID techniques.read more...

Erlangen, 26 February 2008 – The new turnkey system LQ-Axis extends LPKF’s existing spectrum of standard laser plastic welding systems. The laser welding system is designed to specifically meet  the requirements of contour welding of 2D micro and macro-modules. Moreover, it can be well used for the patented hybrid welding technology.read more...