New product requirements demand new manufacturing methods: Following a system upgrade, the LPKF StencilLaser G 6080’s processing capabilities have been extended to stencils of up to 160 centimeters in length, from a previous limit of 80 centimeters. This yields new product options, especially for retrofitting, such as replacing conventional fluorescent tubes with LEDs.read more...
Greater flexibility and manufacturing efficiency with the LPKF Fusion3D 1200 LDS system
The new LPKF Fusion3D 1200 laser structuring system features a rotary indexing table and a vision system. Its flexibility allows for small-, medium-, and large-scale production of MIDs.read more...
Maximum precision and cost-effectiveness with LPKF’s MicroLine 2000 systems
LPKF has added two new UV laser systems, the MicroLine 2000 P and the MicroLine 2000 S, to its range of UV cutting lasers. The MicroLine 2000 P was developed for cutting flexible circuit boards and coverlays. The MicroLine 2000 S can be used for cutting assembled boards out of panels - without creating any stresses and with minimal cutting widths. Both systems are available with various laser sources and offer high precision, flexible production, and cost efficiency.read more...
Greater precision and faster routines with the LPKF CircuitPro PL
LPKF ProtoLasers have long been preferred for high-precision circuit board structuring. Thanks to the new CAM software, they can now achieve greater precision with a faster process.read more...
LPKF ProtoLaser LDI for high-precision resist structuring
Micron-scale resolution - with today’s laser technology, resists for microcomponents can be produced cheaply and quickly. With a new compact laser system, individual trays are exposed directly.read more...
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