LIDE - Laser Induced Deep Etching for IC Packaging
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High Speed TGV Processing with LPKF Vitrion 5000Conventional laser ablation of glasses is prone to micro cracks, chipping and thermally-induced stresses that render it rather inappropriate for processing glasses on a micrometer scale. Alternatively, laser induced deep etching can be used to generate micrometer scale and high aspect ratio features in glass.
LIDE can be used for glass substrates with a thickness of up to 500 μm and panel sizes up to 510 mm x 510 mm. The LPKF Vitrion 5000 utilizes a laser that was developed specifically for these application.
To find out more about our laser tool Vitrion 5000 use the form to order your free brochure.