Laser power for RF applications at the European Microwave Week in Madrid

LPKF Laser & Electronics AG will be presenting a process for extremely fast and highly precise cutting and structuring of laminated RF materials and technical ceramics at this year's European Microwave Week.

Both at booth 322 and at a presentation by laser specialist Lars Führmann on 26 September at 1.30 p.m. in the MicroApps Theatre, LPKF will be demonstrating ways to quickly and precisely implement RF applications with the LPKF ProtoLaser U4.

In-house production gives engineers plenty of creative freedom for the development and manufacture of RF applications. The LPKF ProtoLaser U4 for micro material processing works with a UV laser and was especially developed for use in the electronics laboratory. Feasibility studies of design projects at a very early stage of development or assessments of specific materials for RF applications can thus be carried out without additional service provider-related time expenditure.

The laser system applies a "rubout" strategy for laminated materials, RF components, FR4 or thin flexible materials. The copper is removed by thermal effects and compressed air flow. With the integrated software, laser drillings and laser contour cuts can also be generated.

On technical (fired) ceramics such as Al2O3 or GaN, the laser vaporizes the metal. The user can also use the system to cut ceramics or make blind holes. The products convince through high geometric precision, which moves in the range of +/- 2 μm (+/- 0.8mil), as well as with an exact cutting edge.

The easy to set up and use system software works with standard layout data such as Gerber or DXF. It generates material-specific optimized strategies with which the substrates are treated as gently as possible.

A significant advantage for smaller, non-specialized laboratories: the technology is used without chemicals.

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