Prevention of dust during depaneling
Clean, cost-effective and fast
Problem: Dust on the PCB
Your printed circuit boards are covered with a fine (milling) dust after separation, as in the adjacent picture, although using an extraction unit? Do you have to carry out complex downstream cleaning processes in order to guarantee the technical cleanliness of your PCBs? Do not make any unnecessary compromises or take any unnecssary risks and prevent potential failures in the field! Dust ist not a side affect to be accpeted when cutting the PCB, but can be avoided by choosing the appropriate depaneling tool.
Solution: Laser Depaneling
In contrast to mechanical cutting processes, such as milling, the laser process does not generate any dust. In case of laser depaneling the material is vaporized during the cutting process and the resulting particles are removed with the use of an effective exhausting unit. Laser depaneling is therefore an absolutely dust-free process to singulate your PCBs.
Subsequent (cost-intensive) cleaning steps and malfunctions in the field caused by the dust particles are therefore a thing of the past. By using a laser system, costs can be reduced in a preventive and targeted manner in this way.