Picosecond Laser Processing Advantages as Contract Manufacturing

Why Picosecond Lasers Matter

Standard contract manufacturing laser systems often use nanosecond UV lasers with 15-20 nanosecond pulse widths. These handle most PCB processing efficiently where minor thermal effects are acceptable. Picosecond lasers operate at approximately 10 picoseconds, three orders of magnitude shorter. Material ablation completes before heat diffuses into surrounding areas. The heat-affected zone becomes negligible. Carbonization disappears. The result: pristine cut edges with zero thermal discoloration. No post-processing required. 

For high-volume PCB production, LPKF's CuttingMaster takes this further with CleanCut technology, combining picosecond green laser precision with mass production throughput. 

What Does a Picosecond Laser Deliver for Your Applications? 

Medical implants, high-tech vehicles or devices and high-frequency circuits cannot tolerate edge contamination. LPKF PicoLine processing eliminates it completely, meeting the strictest specifications while delivering smooth vertical sidewalls from 50 µm diameter upward with positioning accuracy of ±20 µm. This enables 20 µm/20 µm line-to-space ratios for TCO/ITO structuring on displays, ultrafine conductor patterns, and isolation channels that standard laser processing cannot achieve consistently. 

Picosecond lasers from LPKF enable advanced materials processing without thermal distortion. LCP and PTFE flexible circuits show zero thermal deformation. Ceramic substrates avoid microcracks from thermal stress. System-in-Package assemblies protect adjacent components from heat exposure. Thin metal foils cut burr-free with edge squareness to ±2 µm. TCO/ITO layers structure cleanly for transparent conductive applications. 

Volume Flexibility thanks to Contract Manufacturing 

Instead of investing in laser technology, manufacturers can integrate partners into the production process. But not every partner can handle picosecond laser quality and not every partner fit to your production level. As a contract manufacturer, customers benefit from the LaserMicronics process at every stage:  

• Low volume production allows for the validation of designs without commitments regarding investments in production tools.  
• Small batches run to optimize the manufacturing processes before scaling up.  
• The series production can take place on identical LPKF systems with consistent results – no unexpected transitions between initial and series production. 
• Unexpected growth phases can be supported by your experienced manufacturing partner 

Design iterations happen fast because updated files go directly to the laser system. This matters during development when circuit layouts evolve and when engineering changes need immediate implementation. LaserMicronics processes 10 boards or hundreds because laser processing eliminates tooling entirely - volume scales with actual demand, not artificial batch requirements. 

Process Development Support 

Are you uncertain whether your application requires picosecond processing? LaserMicronics operates both LPKF MicroLine (nanosecond) and PicoLine (picosecond). Submit sample designs for test processing and microscopic analysis of edge quality, positioning accuracy, and thermal effects. This verification helps you understand which laser technology your tolerances really demand before committing to production. 

Three Decades of LPKF Expertise 

LaserMicronics combines LPKF's market-leading picosecond laser systems with 30 years of laser microprocessing experience. Our engineers optimize process parameters for specific materials and geometries. Quality control procedures developed over thousands of projects to ensure consistent batch-to-batch results. 

Whether you need low volume validation, pilot production series, or recurring volumes, LaserMicronics by LPKF delivers picosecond laser processing with the precision and flexibility your projects demand. Contact us to discuss your requirements and receive sample processing quotes.