News & Press

LPKF press section –
news and image archive
29
 

Press Releases

Laser Induced Deep Etching (LIDE) for thin glass opens new perspectives.


"With the new LIDE precision process, we are enabling microsystems…

[Translate to Englisch:]

Exceptionally gentle on materials, yet precise and fast: The new LPKF ProtoLaser ST

The new ProtoLaser ST from LPKF Laser & Electronics AG is the…

Electronics developers prefer to create their printed circuit boards directly in the laboratory. This is fast and easy with the new circuit board…

The new Managing Director ElectronicsQuipment, Benjamin Klingen-berg, has only been in his new position at LPKF Laser & Electronics since October.…

LPKF presents next generation laser plastic welding 

LPKF Laser & Electronics presents for the first time the new generation of the InlineWeld 6600…

Digital Image Archive

0 Images

Glass Wafer 

produced with Vitrion.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF 1507 Glas Wafer TF 003 1 (jpg - 6,40 MB)
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Management LPKF Laser & Electronics AG

Management of LPKF Laser & Electronics AG: Chief Executive Officer Dr. Goetz M. Bendele (left), Chief Financial Officer Christian Witt (right)

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Management LPKF Laser & Electronics AG (jpg - 1,66 MB)
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Circuit board plotter LPKF ProtoMat S104

Circuit board plotter LPKF ProtoMat S104 for manufacturing of prototype circuit boards.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF ProtoMat S104 (jpg - 743,40 KB)
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LPKF StencilLaser G 6080

LPKF StencilLaser G 6080 for cutting of SMT stencils and micro-cut parts.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF StencilLaser G 6080 (zip - 383,31 KB)
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Scientist in a laser experiment

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Scientist in a laser experiment (jpg - 203,47 KB)
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LPKF ProtoLaser ST

LPKF ProtoLaser ST for manufacturing of prototype circuit boards.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ProtoLaser ST schraeg (jpg - 339,56 KB)
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LPKF PowerWeld 3D 8000

Laser plastic welding System LPKF PowerWeld 3D 8000 for the joining of large 3D plastics parts.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Fig 1 PowerWeld3D (jpg - 609,38 KB)
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LPKF CleanCut Technology for Laser Depaneling

ensures technical cleanliness at the cutting edges and material savings of up to 30%.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF CleanCut (jpg - 1,85 MB)
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LPKF PicoLine 3000 Ci

for exact and extraordinary clean PCB laser depaneling.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

Produkt Picoline 3000 Strich (png - 254,62 KB)
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Micro-chip

produced with LPKF´s LDS technology.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

ICP LDS Microchip Hand (jpg - 727,01 KB)
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Multilayer -

production and processing with LPKF´s machines.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF Application RP TF 068 Multilayer (jpg - 673,03 KB)
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Progress in the production of a PCB -

production and processing in the laboratory with LPKF prototyping equipment.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF Application Ausschnitt Board Evolution (jpg - 751,53 KB)
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Laser cutting of flex material 

using LPKF´s machines.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

LPKF Application PCB 011 Flex (jpg - 887,48 KB)
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Production of automotive tail lights 

with LPKF´s patented laser plastic welding technology.

 

Image author: LPKF Laser & Electronics AG
Image utilization: Photo may be used for reports provided the source is mentioned. Resale to third parties is prohibited.

01 4031 Rueckleuchtenproduktion (jpg - 313,47 KB)
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Press & Public Relations
Product Communications
LPKF Laser & Electronics AG
Osteriede 7
D-30827 Garbsen
 
Fon: +49 (0) 5131 7095-0
Fax: +49 (0) 5131 7095-90