Ultrashort Pulse Laser Processing for Research

The ProtoLaser R from LPKF Laser & Electronics AG is the new flagship for laser micromaterial processing in the laboratory

LPKF recently launched its newly developed ProtoLaser R onto the market, particularly for use in research and development laboratories. It enables high-end processing of thin layers and particularly sensitive materials.
 
Research institutes work with very many different, sophisticated and often newly developed materials in ever smaller formats. They require machines that offer the highest possible degree of flexibility and precision - and high quality standards. This features are the characteristics of the LPKF ProtoLaser R.

The ultrashort pulse (USP) laser used processes materials precisely and without thermal interference in the neighbouring area. This cold ablation is of particular interest for micro- and nano-scale structuring of sensitive materials. For example, the ProtoLaser R proves its extraordinary precision on a special material: With a laser beam diameter of only 15 μm, it structures and cuts 0.2 mm thin carbon foils for LTCC technology. Metallization on titanate can also be structured by Protolaser R precisely and quickly, and the material can be drilled and cut as required without thermal stress.

New possibilities with the LPKF ProtoLaser R
The ProtoLaser R opens up new possibilities in micromachining for laboratory tests with completely new substrates - from flexible materials to glass. It can also gently remove or structure complex thin-film structures, temperature-sensitive substrates or OLED layers on glass. This is of interest even for space travel,"says Britta Schulz, Managing Director Business Unit DevelopmentQuipment. She adds:" The high-precision USP laser allows the creation of exact, layout-accurate geometries and provides a finish with clean and smooth surfaces.

The compact dimensions mean that the ProtoLaser R on rolls fits through any laboratory door.