The New Standard for Small Apertures

With state-of-the-art positioning and cutting technology tailored to the requirements of small openings, extremely small, precise holes can be cut. With a size of just 18 μm on the laser entry side and 10 μm on the exit side (in 30-μm-thick stainless steel foil), they form the basis for overcoming process limitations and catering to rising market demands. High precision and high throughput round out these advantages.  
The simple programming and extensive software functions such as the parameter search help get the process started quickly. Applications include wafer stencils, flux stencils, and filter applications.