Perfectly Clean Cut Edges
Process costs are lower than for conventional cutting processes because intensive cleaning steps are done away with. The nondamaging material processing leads to a higher yield in PCB manufacturing. In addition, less substrate material is used because with a full-section cut using laser technology with a spot size of < 20 µm, more PCBs can be made from a panel. The narrow cutting channel and the completely software-controlled laser process maximize design freedom.
The new systems in the PicoLine series feature a considerably higher travel range of up to 460 x 305 mm (18'' x 12''), and the new granite base provides greater stability.